Issued Patents All Time
Showing 51–69 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9231327 | Electronic circuit slidable interconnect | Weifeng Liu, Murad Kurwa | 2016-01-05 |
| 9112091 | Apparatus and method for an optical package structure using aluminum nitride | Fei Yu, Qi Deng | 2015-08-18 |
| 9053405 | Printed RFID circuit | Weifeng Liu, Murad Kurwa | 2015-06-09 |
| 8952533 | Devices and methods for 2.5D interposers | Weifeng Liu, Rui Niu | 2015-02-10 |
| 8884425 | Thermal management in 2.5 D semiconductor packaging | Vadim Gektin | 2014-11-11 |
| 8604609 | Flange for semiconductor die | Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin P. Law, Michael Opiz Real | 2013-12-10 |
| 8537553 | Devices having anisotropic conductivity heatsinks, and methods of making thereof | Renzhe Zhao | 2013-09-17 |
| 8519543 | Large sized silicon interposers overcoming the reticle area limitations | Haoyu Song, Cao Wei, Rui Niu | 2013-08-27 |
| 8314487 | Flange for semiconductor die | Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin P. Law, Michael Opiz Real | 2012-11-20 |
| 8110445 | High power ceramic on copper package | Soon Ing Chew, Donald Fowlkes | 2012-02-07 |
| 8013429 | Air cavity package with copper heat sink and ceramic window frame | Soon Ing Chew, Alexander Komposch, Christian Andrada | 2011-09-06 |
| 7608860 | Light emitting devices suitable for flip-chip bonding | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Peter Scott Andrews +1 more | 2009-10-27 |
| 7341175 | Bonding of light emitting diodes having shaped substrates | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Peter Scott Andrews +1 more | 2008-03-11 |
| 7259033 | Flip-chip bonding of light emitting devices | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Peter Scott Andrews +1 more | 2007-08-21 |
| 6888167 | Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Peter Scott Andrews +1 more | 2005-05-03 |
| 6747298 | Collets for bonding of light emitting diodes having shaped substrates | David B. Slater, Jr., Jayesh Bharathan, John Edmond, Mark Raffetto, Peter Scott Andrews +1 more | 2004-06-08 |
| 6681483 | Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices | E. James Crescenzi | 2004-01-27 |
| 6466113 | Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices | E. James Crescenzi | 2002-10-15 |
| 5371029 | Process for making a leadless chip resistor capacitor carrier using thick and thin film printing | Azzam A. Abdo | 1994-12-06 |