JW

Jurgen Weichart

EA Evatec Ag: 15 patents #1 of 48Top 3%
OA Oc Oerlikon Balzers Ag: 6 patents #1 of 76Top 2%
OA Oerlikon Advanced Technologies Ag: 1 patents #6 of 20Top 30%
📍 Balzers, LI: #1 of 50 inventorsTop 2%
Overall (All Time): #193,434 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Showing 1–22 of 22 patents

Patent #TitleCo-InventorsDate
11776825 Chamber for degassing substrates Rogier Lodder, Martin Schäfer 2023-10-03
11742187 RF capacitive coupled etch reactor Johannes Weichart 2023-08-29
11469085 Vacuum plasma workpiece treatment apparatus Johannes Weichart 2022-10-11
11217434 RF capacitive coupled dual frequency etch reactor Johannes Weichart 2022-01-04
11211234 Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS) Stanislav Kadlec 2021-12-28
11145495 Vacuum treatment chamber and method of manufacturing a vacuum treated plate-shaped substrate Frantisek Balon 2021-10-12
10692707 RF substrate bias with high power impulse magnetron sputtering (HIPIMS) Stanislav Kadlec 2020-06-23
10580671 Chamber for degassing substrates 2020-03-03
10403522 Chamber for degassing substrates 2019-09-03
10388559 Apparatus for depositing a layer on a substrate in a processing gas Sven Uwe Rieschl, Mohamed Elghazzali 2019-08-20
9934992 Chamber for degassing substrates 2018-04-03
9611537 Target shaping Stanislav Kadlec 2017-04-04
9587306 Method for producing a directional layer by cathode sputtering, and device for implementing the method Hartmut Rohrmann, Hanspeter Friedli, Stanislav Kadlec, Martin Dubs 2017-03-07
9490166 Apparatus and method for depositing a layer onto a substrate Sven Uwe Rieschl, Mohamed Elghazzali 2016-11-08
9355824 Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS) Stanislav Kadlec 2016-05-31
8778144 Method for manufacturing magnetron coated substrates and magnetron sputter source 2014-07-15
8613828 Procedure and device for the production of a plasma Dominik Wimo Amman, Siegfried Krassnitzer 2013-12-24
8475634 Application of HIPIMS to through silicon via metallization in three-dimensional wafer packaging Stanislav Kadlec 2013-07-02
8435389 RF substrate bias with high power impulse magnetron sputtering (HIPIMS) Stanislav Kadlec 2013-05-07
8268142 RF sputtering arrangement Heinz Felzer 2012-09-18
7736462 Installation for processing a substrate 2010-06-15
7476301 Procedure and device for the production of a plasma Dominik Wimo Amman, Siegfried Krassnitzer 2009-01-13