Issued Patents All Time
Showing 51–74 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7602071 | Apparatus for dividing an adhesive film mounted on a wafer | Naoki Ohmiya, Kentaro Iizuka | 2009-10-13 |
| 7553777 | Silicon wafer laser processing method and laser beam processing machine | Yukio Morishige, Yosuke Watanabe | 2009-06-30 |
| 7549560 | Wafer dividing method | Toshiyuki Tateishi, Tadato Nagasawa | 2009-06-23 |
| 7544589 | Wafer dividing method | Masaru Nakamura | 2009-06-09 |
| 7497213 | Wafer dividing apparatus | — | 2009-03-03 |
| 7470566 | Wafer dividing method | Masaru Nakamura | 2008-12-30 |
| 7449396 | Wafer dividing method | Masahiro Murata, Yukio Morishige, Satoshi Kobayashi, Naoki Ohmiya | 2008-11-11 |
| 7435607 | Method of wafer laser processing using a gas permeable protective tape | — | 2008-10-14 |
| 7364986 | Laser beam processing method and laser beam machine | Satoshi Kobayashi | 2008-04-29 |
| 7350446 | Wafer dividing apparatus | — | 2008-04-01 |
| 7348199 | Wafer dividing method | Masaru Nakamura | 2008-03-25 |
| 7332415 | Silicon wafer dividing method and apparatus | Satoshi Kobayashi, Yukio Morishige | 2008-02-19 |
| 7329564 | Wafer dividing method | Masaru Nakamura, Kentaro Iizuka | 2008-02-12 |
| 7279403 | Plate-like workpiece dividing apparatus | Satoshi Kobayashi | 2007-10-09 |
| 7244938 | Method of checking a laser processed deteriorated layer | — | 2007-07-17 |
| 7232741 | Wafer dividing method | Masaru Nakamura, Satoshi Kobayashi, Yukio Morishige | 2007-06-19 |
| 7223937 | Laser beam processing method and laser beam processing machine | Satoshi Kobayashi | 2007-05-29 |
| 7179721 | Method of dividing a non-metal substrate | — | 2007-02-20 |
| 7179724 | Wafer processing method | Tadato Nagasawa | 2007-02-20 |
| 7179722 | Wafer dividing method | Masahiro Murata, Yukio Morishige, Satoshi Kobayashi, Naoki Ohmiya | 2007-02-20 |
| 7141443 | Semiconductor wafer dividing method utilizing laser beam | Satoshi Kobayashi | 2006-11-28 |
| 7134942 | Wafer processing method | Masashi Aoki, Hitoshi Hoshino | 2006-11-14 |
| 7134943 | Wafer processing method | Masashi Aoki, Satoshi Kobayashi | 2006-11-14 |
| 7063083 | Wafer dividing method and apparatus | Naoki Ohmiya, Masaru Nakamura | 2006-06-20 |