Issued Patents All Time
Showing 101–125 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D635525 | LED chip | John Edmond, Matthew Donofrio, Winston T. Parker | 2011-04-05 |
| 7910938 | Encapsulant profile for light emitting diodes | Christopher P. Hussell, Brian T. Collins, David T. Emerson | 2011-03-22 |
| 7795623 | Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures | David T. Emerson, Kevin Haberern, David B. Slater, Jr., Matthew Donofrio, John Edmond | 2010-09-14 |
| 7791101 | Indium gallium nitride-based ohmic contact layers for gallium nitride-based devices | Daniel Carleton Driscoll, David T. Emerson | 2010-09-07 |
| 7737459 | High output group III nitride light emitting diodes | John Edmond, David T. Emerson, Kevin Haberern | 2010-06-15 |
| 7692182 | Group III nitride based quantum well light emitting device structures with an indium containing capping structure | David T. Emerson | 2010-04-06 |
| 7692209 | Group III nitride LED with undoped cladding layer | John Edmond, Kathleen Marie Doverspike, Hua-Shuang Kong | 2010-04-06 |
| 7649209 | Side-view surface mount white LED | Christopher P. Hussell, Brian T. Collins, David T. Emerson | 2010-01-19 |
| 7645342 | Restricted radiated heating assembly for high temperature processing | David T. Emerson, Robert Garner, Keenan Carlyle Brown, Michael Allen Pennington, Thomas G. Coleman | 2010-01-12 |
| 7611917 | Methods of forming light emitting devices with active layers that extend into opened pits | David T. Emerson | 2009-11-03 |
| D602450 | LED chip | John Edmond, James Ibbetson, Amber Christine Salter, David T. Emerson, Ashay Chitnis +2 more | 2009-10-20 |
| 7557379 | Light emitting devices having a roughened reflective bond pad and methods of fabricating light emitting devices having roughened reflective bond pads | Kevin Haberern, Van Mieczkowski, David T. Emerson | 2009-07-07 |
| 7557380 | Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads | Kevin Haberern, Van Mieczkowski, David T. Emerson | 2009-07-07 |
| D593968 | LED chip | John Edmond, James Ibbetson, Amber Christine Salter, David T. Emerson, Ashay Chitnis +2 more | 2009-06-09 |
| 7531840 | Light emitting diode with metal coupling structure | John Edmond, Kathleen Marie Doverspike, Hua-Shuang Kong | 2009-05-12 |
| 7482183 | Light emitting diode with degenerate coupling structure | John Edmond, Kathleen Marie Doverspike, Hua-Shuang Kong | 2009-01-27 |
| D583338 | LED chip | John Edmond, James Ibbetson, Amber Christine Salter, David T. Emerson, Ashay Chitnis +2 more | 2008-12-23 |
| D582866 | LED chip | John Edmond, James Ibbetson, Amber Christine Salter, David T. Emerson, Ashay Chitnis +2 more | 2008-12-16 |
| 7446345 | Light emitting devices with active layers that extend into opened pits | David T. Emerson | 2008-11-04 |
| D566057 | LED chip | John Edmond, James Ibbetson, Amber Christine Salter, David T. Emerson, Kevin Haberern | 2008-04-08 |
| D566056 | LED chip | John Edmond, James Ibbetson, Amber Christine Salter, David T. Emerson, Kevin Haberern | 2008-04-08 |
| 7312474 | Group III nitride based superlattice structures | David T. Emerson, James Ibbetson, Kathleen Marie Doverspike, Michael O'Loughlin, Howard Nordby +1 more | 2007-12-25 |
| 7170097 | Inverted light emitting diode on conductive substrate | John Edmond, Kathleen Marie Doverspike, Hua-Shuang Kong | 2007-01-30 |
| 7071490 | Group III nitride LED with silicon carbide substrate | John Edmond, Kathleen Marie Doverspike, Hua-Shuang Kong | 2006-07-04 |
| 6987281 | Group III nitride contact structures for light emitting devices | John Edmond, Kathleen Marie Doverspike, Hua-Shuang Kong | 2006-01-17 |