JH

James L. Hedrick

CL Central Glass Company, Limited: 5 patents #163 of 968Top 20%
IN Institute Of Bioengineering And Nanotechnology: 4 patents #1 of 18Top 6%
HB Hitachi Global Storage Netherlands, B.V.: 4 patents #2 of 32Top 7%
SU Stanford University: 3 patents #11 of 261Top 5%
HG HGST: 2 patents #738 of 1,677Top 45%
NS National University Of Singapore: 2 patents #231 of 1,623Top 15%
Dow Global Technologies: 1 patents #2,632 of 4,534Top 60%
KT King Abdulaziz City For Science And Technology: 1 patents #232 of 573Top 45%
University of California: 1 patents #8,022 of 18,278Top 45%
LI Lexmark International: 1 patents #1,041 of 1,615Top 65%
📍 Pleasanton, CA: #2 of 3,062 inventorsTop 1%
🗺 California: #159 of 386,348 inventorsTop 1%
Overall (All Time): #837 of 4,157,543Top 1%
359
Patents All Time

Issued Patents All Time

Showing 326–350 of 359 patents

Patent #TitleCo-InventorsDate
6150001 Magnetic recording disk with polycyanate ester overlayer Charles Mathew Mate, Junhua Wu 2000-11-21
6143643 Process for manufacture of integrated circuit device using organosilicate insulative matrices Kenneth Raymond Carter, Craig J. Hawker, Victor Y. Lee, Robert D. Miller, Willi Volksen +1 more 2000-11-07
6114458 Highly branched radial block copolymers Craig J. Hawker, Olof Mikael Trollsas 2000-09-05
6111323 Reworkable thermoplastic encapsulant Kenneth Raymond Carter, Craig J. Hawker, Robert D. Miller, Michael A. Gaynes, Stephen L. Buchwalter 2000-08-29
6110649 Process for manufacture of integrated circuit device Kenneth Raymond Carter, Craig J. Hawker, Robert D. Miller, Bernhard Pogge 2000-08-29
6107357 Dielectric compositions and method for their manufacture Craig J. Hawker, Robert D. Miller, Willi Volksen 2000-08-22
6093636 Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets Kenneth Raymond Carter, Daniel J. Dawson, Craig J. Hawker, Jeffrey Hedrick, Victor Y. Lee +3 more 2000-07-25
6054651 Foamed elastomers for wafer probing applications and interposer connectors Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Da-Yuan Shih 2000-04-25
5998876 Reworkable thermoplastic hyper-branched encapsulant Kenneth Raymond Carter, Craig J. Hawker, Robert D. Miller, Michael A. Gaynes, Stephen L. Buchwalter 1999-12-07
5962113 Integrated circuit device and process for its manufacture Hugh Ralph Brown, Kenneth Raymond Carter, Hyuk-Jin Cha, Richard Anthony DiPietro, John P. Hummel +2 more 1999-10-05
5953627 Process for manufacture of integrated circuit device Kenneth Raymond Carter, Robert F. Cook, Martha Alyne Harbison, Craig J. Hawker, Sung-Mog Kim +4 more 1999-09-14
5895263 Process for manufacture of integrated circuit device Kenneth Raymond Carter, Daniel J. Dawson, Richard Anthony DiPietro, Craig J. Hawker, Robert D. Miller +1 more 1999-04-20
5883219 Integrated circuit device and process for its manufacture Kenneth Raymond Carter, Daniel J. Dawson, Richard Anthony DiPietro, Craig J. Hawker, Robert D. Miller +1 more 1999-03-16
5804607 Process for making a foamed elastomeric polymer Jeffrey Hedrick, Jons Hilborn, Yun-Hsin Liao, Robert D. Miller, Da-Yuan Shih 1998-09-08
5776990 Foamed polymer for use as dielectric material Donald C. Hofer, Jeffrey W. Labadie, Robert Bruce Prime, Thomas P. Russell 1998-07-07
5773197 Integrated circuit device and process for its manufacture Kenneth Raymond Carter, Robert D. Miller 1998-06-30
5767014 Integrated circuit and process for its manufacture Craig J. Hawker, Robert D. Miller 1998-06-16
5756021 Electronic devices comprising dielectric foamed polymers Da-Yuan Shih 1998-05-26
5726211 Process for making a foamed elastometric polymer Jeffrey Hedrick, Jons Hilborn, Yun-Hsin Liao, Robert D. Miller, Da-Yuan Shih 1998-03-10
5700844 Process for making a foamed polymer Jeffrey Hedrick, Yun-Hsin Liao, Robert D. Miller, Da-Yuan Shih 1997-12-23
5660921 Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures Kie Y. Ahn, Jeffrey W. Labadie, Kang-Wook Lee, Robert J. Twieg, Alfred Viehbeck +1 more 1997-08-26
5633034 Process for forming a circuit assembly Kenneth Raymond Carter, Richard Anthony DiPietro, John P. Hummel, Robert D. Miller, Martha I. Sanchez +2 more 1997-05-27
5593720 Process for making a multileveled electronic package Kie Y. Ahn, Jeffrey W. Labadie, Kang-Wook Lee, Robert J. Twieg, Alfred Viehbeck +1 more 1997-01-14
5591285 Fluorinated carbon polymer composites Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster +7 more 1997-01-07
5571852 Fluorinated carbon polymer composites Ali Afzali-Ardakani, Juan Ayala-Esquilin, Bodil E. Braren, Shahrokh Daijavad, Elizabeth Foster +7 more 1996-11-05