Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960038 | Processes to pattern small features for advanced patterning needs | James E. Lamb, III, Nickolas L. Brakensiek, Qin Lin, Yubao Wang, Vandana Krishnamurthy +1 more | 2018-05-01 |
| 8968989 | Assist layers for EUV lithography | Tantiboro Ouattara, Vandana Krishnamurthy, Douglas J. Guerrero, Aline Collin | 2015-03-03 |
| 8877430 | Methods of producing structures using a developer-soluble layer with multilayer technology | James E. Lamb, III, Brian Smith, Justin Lee Furse, Heping Wang | 2014-11-04 |
| 7602066 | Method of filling structures for forming via-first dual damascene interconnects | Nickolas L. Brakensiek, Earnest C. Murphy | 2009-10-13 |
| 7364835 | Developer-soluble materials and methods of using the same in via-first dual damascene applications | Mandar Bhave, Rama Puligadda, Kevin Edwards | 2008-04-29 |
| 7348281 | Method of filling structures for forming via-first dual damascene interconnects | Nickolas L. Brakensiek, Earnest C. Murphy | 2008-03-25 |