Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7602066 | Method of filling structures for forming via-first dual damascene interconnects | Nickolas L. Brakensiek, Carlton Ashley Washburn | 2009-10-13 |
| 7348281 | Method of filling structures for forming via-first dual damascene interconnects | Nickolas L. Brakensiek, Carlton Ashley Washburn | 2008-03-25 |
| 5892096 | Non-subliming mid-UV dyes and ultra-thin organic arcs having differential solubility | Jim D. Meador, Xie Shao, Vandana Krishnamurthy, Tony D. Flaim, Terry Brewer | 1999-04-06 |
| 5688987 | Non-subliming Mid-UV dyes and ultra-thin organic arcs having differential solubility | Jim D. Meador, Xie Shao, Vandana Krishnamurthy, Tony D. Flaim, Terry Brewer | 1997-11-18 |