Issued Patents All Time
Showing 276–299 of 299 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6563641 | Fold interleaver | — | 2003-05-13 |
| 6509623 | Microelectronic air-gap structures and methods of forming the same | — | 2003-01-21 |
| 6445073 | Damascene metallization process and structure | — | 2002-09-03 |
| 6444136 | Fabrication of improved low-k dielectric structures | Q. Z. Liu | 2002-09-03 |
| 6417094 | Dual-damascene interconnect structures and methods of fabricating same | Liming Tsau | 2002-07-09 |
| 6396122 | Method for fabricating on-chip inductors and related structure | David J. Howard, Q. Z. Liu | 2002-05-28 |
| 6329290 | Method for fabrication and structure for high aspect ratio vias | — | 2001-12-11 |
| 6309922 | Method for fabrication of on-chip inductors and related structure | Q.Z. Liu, David J. Howard | 2001-10-30 |
| 6280794 | Method of forming dielectric material suitable for microelectronic circuits | King-Ning Tu, Yuhuan Xu | 2001-08-28 |
| 6271127 | Method for dual damascene process using electron beam and ion implantation cure methods for low dielectric constant materials | Qizhi Liu, David Feiler, Maureen R. Brongo | 2001-08-07 |
| 6245663 | IC interconnect structures and methods for making same | Maureen R. Brongo | 2001-06-12 |
| 6211561 | Interconnect structure and method employing air gaps between metal lines and between metal layers | — | 2001-04-03 |
| 6198170 | Bonding pad and support structure and method for their fabrication | — | 2001-03-06 |
| 6187672 | Interconnect with low dielectric constant insulators for semiconductor integrated circuit manufacturing | Maureen R. Brongo | 2001-02-13 |
| 6100184 | Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer | Prahalad K. Vasudev, Ronald S. Horwath, Thomas E. Seidel, Peter M. Zeitzoff | 2000-08-08 |
| 6071809 | Methods for forming high-performing dual-damascene interconnect structures | — | 2000-06-06 |
| 6037664 | Dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer | Prahalad K. Vasudev, Ronald S. Horwath, Thomas E. Seidel, Peter M. Zeitzoff | 2000-03-14 |
| 5891513 | Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications | Valery M. Dubin, Yosef Shacham-Diamand, Chiu H. Ting, Prahalad K. Vasudev | 1999-04-06 |
| 5830805 | Electroless deposition equipment or apparatus and method of performing electroless deposition | Yosi Shacham-Diamand, Valery M. Dubin, Chiu H. Ting, Prahalad K. Vasudev | 1998-11-03 |
| 5824599 | Protected encapsulation of catalytic layer for electroless copper interconnect | Yosef Schacham-Diamand, Valery M. Dubin, Chiu H. Ting, Prahalad K. Vasudev, Melvin Joseph DeSilva | 1998-10-20 |
| 5736457 | Method of making a damascene metallization | — | 1998-04-07 |
| 5695810 | Use of cobalt tungsten phosphide as a barrier material for copper metallization | Valery M. Dubin, Yosi Schacham-Diamand, Prahalad K. Vasudev, Chiu H. Ting | 1997-12-09 |
| 5674787 | Selective electroless copper deposited interconnect plugs for ULSI applications | Prahalad K. Vasudev, Valery M. Dubin, Yosef Shacham-Diamand, Chiu H. Ting | 1997-10-07 |
| 5660706 | Electric field initiated electroless metal deposition | Prahalad K. Vasudev | 1997-08-26 |