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Chemical mechanical polishing (CMP) composition comprising a polymeric polyamine |
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| 10090159 |
Chemical-mechanical polishing compositions comprising one or more polymers selected from the group consisting of N-vinyl-homopolymers and N-vinyl copolymers |
Yongqing Lan, Peter Przybylski, Julian Proelss |
2018-10-02 |
| 9862862 |
Chemical-mechanical polishing compositions comprising polyethylene imine |
Yongqing Lan, Peter Przybylski, Julian Proelss |
2018-01-09 |
| 9828527 |
Chemical-mechanical polishing compositions comprising N,N,N′,N′-tetrakis-(2-hydroxypropyl)-ethylenediamine or methanesulfonic acid |
Yongqing Lan, Peter Przybylski, Julian Proelss |
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| 9765239 |
Use of a chemical-mechanical polishing (CMP) composition for polishing a substrate or layer containing at least one III-V material |
Yongqing Lan, Peter Przybylski, Julian Proelss |
2017-09-19 |
