| 8569692 |
Measurement system with thickness calculation and method of operation thereof |
Biao Liu, Chikuang Charles Wang |
2013-10-29 |
| 7963153 |
Non-destructive ambient dynamic mode AFM amplitude versus distance curve acquisition |
Chikuang Charles Wang, Biao Liu |
2011-06-21 |
| 7601648 |
Method for fabricating an integrated gate dielectric layer for field effect transistors |
Thai Cheng Chua, Shankar Muthukrisnan, Johanes F. Swenberg, Shreyas Kher, Chikuang Charles Wang +1 more |
2009-10-13 |
| 7509844 |
Atomic force microscope technique for minimal tip damage |
Chikuang Charles Wang, Thai Cheng Chua |
2009-03-31 |
| 6122562 |
Method and apparatus for selectively marking a semiconductor wafer |
Patrick Kinney, Nagaraja Rao |
2000-09-19 |
| 6051845 |
Method and apparatus for selectively marking a semiconductor wafer |
— |
2000-04-18 |
| 5985680 |
Method and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate system |
Ajay Singhal, Patrick Kinney |
1999-11-16 |
| 5870187 |
Method for aligning semiconductor wafer surface scans and identifying added and removed particles resulting from wafer handling or processing |
Patrick Kinney, Man-Ping Cai |
1999-02-09 |
| 5628870 |
Method for marking a substrate using ionized gas |
Yan Ye, Anand Gupta |
1997-05-13 |
| 5497007 |
Method for automatically establishing a wafer coordinate system |
Harry Q. Lee |
1996-03-05 |
| 5474640 |
Apparatus for marking a substrate using ionized gas |
Yan Ye, Anand Gupta |
1995-12-12 |
| 5422724 |
Multiple-scan method for wafer particle analysis |
Patrick Kinney, Harry Q. Lee |
1995-06-06 |
| 5381004 |
Particle analysis of notched wafers |
Harry Q. Lee |
1995-01-10 |
| 5267017 |
Method of particle analysis on a mirror wafer |
Harry Q. Lee, Patrick Kinney, Kang-Ho Ahn |
1993-11-30 |
