Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9757050 | Catheter balloon employing force sensing elements | Roozbeh Ghaffari | 2017-09-12 |
| 9706647 | Conformal electronics including nested serpentine interconnects | John Work, Kevin Dowling | 2017-07-11 |
| 9622680 | Catheter balloon methods and apparatus employing sensing elements | Roozbeh Ghaffari, Robert D'Angelo, Bassel de Graff, Kevin Dowling, Lauren Klinker +2 more | 2017-04-18 |
| 9579040 | Electronics for detection of a condition of tissue | Conor S. Rafferty, Jeffrey D. Carbeck, Alexander Dickson, Kevin Dowling, Isaiah Kacyvenski +2 more | 2017-02-28 |
| 9554850 | Catheter device including flow sensing | Stephen P. Lee, Clifford M. Liu, Roozbeh Ghaffari, John Work, Fernando Quivira +1 more | 2017-01-31 |
| 9545216 | Catheter balloon methods and apparatus employing sensing elements | Robert D'Angelo, Bassel de Graff, Kevin Dowling, Roozbeh Ghaffari, Lauren Klinker +2 more | 2017-01-17 |
| 9408305 | Strain isolation structures for stretchable electronics | — | 2016-08-02 |
| 9247637 | Strain relief structures for stretchable interconnects | — | 2016-01-26 |
| 9226402 | Strain isolation structures for stretchable electronics | — | 2015-12-29 |
| 9168094 | Catheter device including flow sensing | Stephen P. Lee, Clifford M. Liu, Roozbeh Ghaffari, John Work, Fernando Quivira +1 more | 2015-10-27 |
| 8123965 | Interconnect structure with stress buffering ability and the manufacturing method thereof | Shyi-Ching Liau, Ra-Min Tain, Jr-Yuan Jeng | 2012-02-28 |
| 8026603 | Interconnect structure of an integrated circuit and manufacturing method thereof | Chih-Yuan Cheng, Shyi-Ching Liau, Min-Lin Lee, Ra-Min Tain, Rong-Chang Feng | 2011-09-27 |
| 7754599 | Structure for reducing stress for vias and fabricating method thereof | Rong-Chang Feng, Ra-Min Tain, Shyi-Ching Liau, Ji-Cheng Lin, Shan-Pu Yu +2 more | 2010-07-13 |
| 7586187 | Interconnect structure with stress buffering ability and the manufacturing method thereof | Shyi-Ching Liau, Ra-Min Tain, Jr-Yuan Jeng | 2009-09-08 |
| 7545039 | Structure for reducing stress for vias and fabricating method thereof | Rong-Chang Feng, Ra-Min Tain, Shyi-Ching Liau, Ji-Cheng Lin, Shan-Pu Yu +2 more | 2009-06-09 |
| 7211886 | Three-dimensional multichip stack electronic package structure | Kuo-Ning Chiang, Chang-An Yuan, Chang-Chun Lee, Hsien-Chie Cheng | 2007-05-01 |
| 5063260 | Compositions and their use for treating fibers | Kun-Long Chen | 1991-11-05 |