Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7211886 | Three-dimensional multichip stack electronic package structure | Yung-Yu Hsu, Kuo-Ning Chiang, Chang-Chun Lee, Hsien-Chie Cheng | 2007-05-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7211886 | Three-dimensional multichip stack electronic package structure | Yung-Yu Hsu, Kuo-Ning Chiang, Chang-Chun Lee, Hsien-Chie Cheng | 2007-05-01 |