Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10338251 | Method and apparatus for directional designature | Yunfeng Li, Suryadeep Ray, Gordon POOLE | 2019-07-02 |
| 9129957 | Method of forming a metal bump | Ching-Yuan Ho | 2015-09-08 |
| 7211886 | Three-dimensional multichip stack electronic package structure | Yung-Yu Hsu, Kuo-Ning Chiang, Chang-An Yuan, Hsien-Chie Cheng | 2007-05-01 |