Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10707138 | High yield package assembly technique | Shiying Xiong, Felino E. Pagaduan, Qi Xiang, Xiao-Yu Li, Glenn O'Rourke | 2020-07-07 |
| 9000490 | Semiconductor package having IC dice and voltage tuners | Andy H. Gan, Xiao-Yu Li, Matthew H. Klein | 2015-04-07 |
| 5598341 | Real-time in-line defect disposition and yield forecasting system | Zhi-Min Ling, Siu May Ho, Ying Shiau, Yeng-Kaung Peng, Yung-Tao Lin | 1997-01-28 |
| 5561293 | Method of failure analysis with CAD layout navigation and FIB/SEM inspection | Yeng-Kaung Peng, Paul Wong | 1996-10-01 |