Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7030044 | Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric | Hartmut Ruelke, Thomas Werner, Frank Mauersberger | 2006-04-18 |
| 7022602 | Nitrogen-enriched low-k barrier layer for a copper metallization layer | Hartmut Ruelke, Thomas Werner, Michael Kiene | 2006-04-04 |
| 6893956 | Barrier layer for a copper metallization layer including a low-k dielectric | Hartmut Ruelke, Thomas Werner, Massud Aminpur | 2005-05-17 |
| 6596631 | Method of forming copper interconnect capping layers with improved interface and adhesion | Minh Van Ngo, Hartmut Ruelke, Lothar Mergili, Lu You, Robert A. Huertas +1 more | 2003-07-22 |
| 6569768 | Surface treatment and capping layer process for producing a copper interface in a semiconductor device | Hartmut Ruelke, Minh Van Ngo | 2003-05-27 |
| 6368948 | Method of forming capped copper interconnects with reduced hillocks | Minh Van Ngo, Hartmut Ruelke, Lothar Mergili | 2002-04-09 |