Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596631 | Method of forming copper interconnect capping layers with improved interface and adhesion | Minh Van Ngo, Lothar Mergili, Joerg Hohage, Lu You, Robert A. Huertas +1 more | 2003-07-22 |
| 6569768 | Surface treatment and capping layer process for producing a copper interface in a semiconductor device | Joerg Hohage, Minh Van Ngo | 2003-05-27 |
| 6506677 | Method of forming capped copper interconnects with reduced hillock formation and improved electromigration resistance | Steven C. Avanzino, Minh Van Ngo, Amit P. Marathe | 2003-01-14 |
| 6372668 | Method of forming silicon oxynitride films | Sey-Ping Sun, Homi E. Nariman | 2002-04-16 |
| 6368948 | Method of forming capped copper interconnects with reduced hillocks | Minh Van Ngo, Joerg Hohage, Lothar Mergili | 2002-04-09 |
| 6235654 | Process for forming PECVD nitride with a very low deposition rate | Minh Van Ngo, Robert A. Huertas | 2001-05-22 |
| 6221793 | Process for forming PECVD undoped oxide with a super low deposition rate on a single state deposition | Minh Van Ngo, Robert A. Huertas | 2001-04-24 |