Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9311189 | Method and device for inputting data in multimedia service database on embedded device | Peifeng Lao | 2016-04-12 |
| 9230949 | Method of making stacked multi-chip packaging structure | Hua Pan, Ming-Chen Lu, Jun Lu, Hamza Yilmaz | 2016-01-05 |
| 9165866 | Stacked dual chip package having leveling projections | Hamza Yilmaz, Yan Xun Xue, Anup Bhalla, Jun Lu, Kai Liu +2 more | 2015-10-20 |
| 9006870 | Stacked multi-chip packaging structure and manufacturing method thereof | Hua Pan, Ming-Chen Lu, Jun Lu, Hamza Yilmaz | 2015-04-14 |
| 8952509 | Stacked multi-chip bottom source semiconductor device and preparation method thereof | Hamza Yilmaz, Yueh-Se Ho, Yan Xun Xue, Jun Lu, Zhi Qiang Niu +4 more | 2015-02-10 |
| 8669650 | Flip chip semiconductor device | Hamza Yilmaz, Jun Lu, Xiaoguang Zeng, Ming-Chen Lu | 2014-03-11 |
| 8581376 | Stacked dual chip package and method of fabrication | Hamza Yilmaz, Yan Xun Xue, Anup Bhalla, Jun Lu, Kai Liu +2 more | 2013-11-12 |
| 8563360 | Power semiconductor device package and fabrication method | Jun Lu, Francois Hebert, Kai Liu | 2013-10-22 |
| 8484318 | Method, apparatus and system for upgrading through multicast | Junxia Xu | 2013-07-09 |
| 8455303 | Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method | Jun Lu | 2013-06-04 |
| 8344519 | Stacked-die package for battery power management | Jun Lu, Allen Timothy Chang | 2013-01-01 |
| 8222088 | Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method | Jun Lu | 2012-07-17 |
| 8217748 | Compact inductive power electronics package | Tao Feng, Francois Hebert, Ming Sun | 2012-07-10 |
| 8150982 | Method, system for accessing home network device and home network access device | Junxia Xu, Huangwei Wu | 2012-04-03 |
| 8058961 | Lead frame-based discrete power inductor | Francois Hebert, Tao Feng, Jun Lu | 2011-11-15 |
| 8049315 | Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package | Jun Lu, Anup Bhalla, Xiaobin Wang, Allen Timothy Chang, Kenny Hu | 2011-11-01 |
| 7951651 | Dual flat non-leaded semiconductor package | Kai Liu, Ming Sun, Leeshawn Luo | 2011-05-31 |
| 7898092 | Stacked-die package for battery power management | Jun Lu, Allen Timothy Chang | 2011-03-01 |
| 7884452 | Semiconductor power device package having a lead frame-based integrated inductor | Tao Feng, Francois Hebert | 2011-02-08 |
| 7884454 | Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package | Jun Lu, Anup Bhalla, Xiaobin Wang, Allen Timothy Chang, Man Sheng Hu | 2011-02-08 |
| 7884696 | Lead frame-based discrete power inductor | Francois Hebert, Tao Feng, Jun Lu | 2011-02-08 |
| 7868431 | Compact power semiconductor package and method with stacked inductor and integrated circuit die | Tao Feng, Francois Hebert, Ming Sun | 2011-01-11 |
| 7781265 | DFN semiconductor package having reduced electrical resistance | Kai Liu, Ming Sun | 2010-08-24 |
| 7759775 | High current semiconductor power device SOIC package | Ming Sun, Lei Shi | 2010-07-20 |
| 7612439 | Semiconductor package having improved thermal performance | Argo Chang, James Cheng Lee, Ryan Huang, Kai Liu, Ming Sun | 2009-11-03 |