Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053906 | Semiconductor package and method for processing and bonding a wire | Hsiao-Chuan Chang, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +3 more | 2011-11-08 |
| 8018075 | Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package | Hsiao-Chuan Chang, Yi-Shao Lai, Ho-Ming Tong, Jian-Cheng Chen, Wei Chi Yih +1 more | 2011-09-13 |
| 7980757 | Bonding strength measuring device | Yi-Shao Lai, Hsiao-Chuan Chang | 2011-07-19 |
| 7969559 | Laser distance measuring apparatus and control method thereof | Yin-Long Luo | 2011-06-28 |
| 7964949 | Tenon-and-mortise packaging structure | Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen | 2011-06-21 |
| 7955897 | Chip structure and stacked chip package as well as method for manufacturing chip structures | Yi-Shao Lai, Cheng-Wei Huang | 2011-06-07 |
| 7773203 | Laser distance-measuring apparatus and control methods thereof | — | 2010-08-10 |
| 7071553 | Package structure compatible with cooling system | Sheng-Yang Peng | 2006-07-04 |
| 7037750 | Method for manufacturing a package | Yu-Fang Tsai, Chin-Hsien Lin | 2006-05-02 |
| 7026709 | Stacked chip-packaging structure | Yu-Fang Tsai, Jung-Kun Kang | 2006-04-11 |
| 7015065 | Manufacturing method of ball grid array package | Yu-Fang Tsai, Jung-Kun Kang | 2006-03-21 |
| 6873778 | Fiber container and associated optical communication device | Chin-Hsiang Wang, Yu-Ting Lee, Chih-Hsien Lin | 2005-03-29 |
| 6854900 | Method of fabricating a wavelength division multiplexed (WDM) unit | I-Jen Lai, Pie-Yau Chien, Chin-Hsiang Wang, Yu-Ting Lee, Chih-Hsien Lin | 2005-02-15 |
| 6801429 | Package structure compatible with cooling system | Sheng-Yang Peng | 2004-10-05 |
| 6797941 | Reliable optical add/drop device | Chin-Hsiang Wang, Chih-Hsiang Lin | 2004-09-28 |