Issued Patents 2025
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237277 | Package structure and methods of manufacturing the same | Shu-Shen Yeh, Po-Yao Lin, Chia-Kuei Hsu, Shin-Puu Jeng | 2025-02-25 |
| 12237276 | Package structure | Po-Chen Lai, Ming-Chih Yew, Che-Chia Yang, Shu-Shen Yeh, Po-Yao Lin +1 more | 2025-02-25 |
| 12232307 | Dummy metal bonding pads for underfill application in semiconductor die packaging and methods of forming the same | Ming-Chih Yew, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-02-18 |
| 12218023 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chien-Hung Chen, Po-Yao Lin, Shin-Puu Jeng | 2025-02-04 |
| 12191272 | Package structure | Tsung-Yen Lee, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-01-07 |
| 12191294 | Package structure and method of forming the same | Po-Yao Lin, Shu-Shen Yeh, Yu-Sheng Lin, Shin-Puu Jeng | 2025-01-07 |