Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431386 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2025-09-30 |
| 12431426 | Semiconductor interconnection structures comprising a resistor device and methods of forming the same | Kai-Fang Cheng, Cheng-Chin Lee, Ming-Hsien Lin, Hsiao-Kang Chang | 2025-09-30 |
| 12412804 | Semiconductor structure with improved heat dissipation | Cheng-Chin Lee, Shau-Lin Shue, Shao-Kuan Lee, Hsiao-Kang Chang, Kai-Fang Cheng +6 more | 2025-09-09 |
| 12412831 | Semiconductor device structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Yung-Hsu Wu, Chia-Wei Su | 2025-09-09 |
| 12272597 | Semiconductor interconnection structures and methods of forming the same | Cheng-Chin Lee, Hsiao-Kang Chang, Hsin-Yen Huang, Shao-Kuan Lee, Shau-Lin Shue | 2025-04-08 |
| 12249555 | Semiconductor device package including a thermal conductive layer and methods of forming the same | Cheng-Chin Lee, Shao-Kuan Lee, Hsiao-Kang Chang, Hsin-Yen Huang, Shau-Lin Shue | 2025-03-11 |
| 12211700 | Selective removal of an etching stop layer for improving overlay shift tolerance | Chien-Hua Huang, Tzu-Hui Wei | 2025-01-28 |
| 12205946 | Semiconductor device structure and methods of forming the same | Kai-Fang Cheng, Kuang-Wei YANG, Hsiaokang CHANG | 2025-01-21 |