Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
CL

Cheng-Chin Lee

TSMC: 11 patents #221 of 3,957Top 6%
Overall (2025): #5,311 of 469,880Top 2%
11
Patents 2025

Issued Patents 2025

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDate
12431426 Semiconductor interconnection structures comprising a resistor device and methods of forming the same Kai-Fang Cheng, Cherng-Shiaw Tsai, Ming-Hsien Lin, Hsiao-Kang Chang 2025-09-30
12431386 Semiconductor device having metallization layer with low capacitance and method for manufacturing the same Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee, Kuang-Wei YANG +4 more 2025-09-30
12412780 Semiconductor device structure and methods of forming the same Hsin-Yen Huang, Shao-Kuan Lee, Ting-Ya Lo, Chi-Lin Teng, Hsiaokang CHANG +1 more 2025-09-09
12412804 Semiconductor structure with improved heat dissipation Shau-Lin Shue, Shao-Kuan Lee, Hsiao-Kang Chang, Cherng-Shiaw Tsai, Kai-Fang Cheng +6 more 2025-09-09
12381113 Semiconductor device structure having air gap and methods of forming the same Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsin-Yen Huang, Hsiaokang CHANG +1 more 2025-08-05
12381143 Self-align via structure by selective deposition Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue 2025-08-05
12308286 Interconnect structures including air gaps Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue 2025-05-20
12278143 Method of providing a workpiece including low resistance interconnect low-resistance interconnect Hsin-Yen Huang, Shao-Kuan Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu +2 more 2025-04-15
12272597 Semiconductor interconnection structures and methods of forming the same Hsiao-Kang Chang, Hsin-Yen Huang, Cherng-Shiaw Tsai, Shao-Kuan Lee, Shau-Lin Shue 2025-04-08
12249555 Semiconductor device package including a thermal conductive layer and methods of forming the same Cherng-Shiaw Tsai, Shao-Kuan Lee, Hsiao-Kang Chang, Hsin-Yen Huang, Shau-Lin Shue 2025-03-11
12230537 Semiconductor device structure having air gap and methods of forming the same Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsin-Yen Huang, Hsiaokang CHANG +1 more 2025-02-18