Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431386 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +4 more | 2025-09-30 |
| 12412780 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2025-09-09 |
| 12412804 | Semiconductor structure with improved heat dissipation | Cheng-Chin Lee, Shau-Lin Shue, Shao-Kuan Lee, Hsiao-Kang Chang, Cherng-Shiaw Tsai +6 more | 2025-09-09 |
| 12381113 | Semiconductor device structure having air gap and methods of forming the same | Ting-Ya Lo, Cheng-Chin Lee, Shao-Kuan Lee, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2025-08-05 |
| 12381143 | Self-align via structure by selective deposition | Shao-Kuan Lee, Cheng-Chin Lee, Hai-Ching Chen, Shau-Lin Shue | 2025-08-05 |
| 12308286 | Interconnect structures including air gaps | Cheng-Chin Lee, Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue | 2025-05-20 |
| 12278143 | Method of providing a workpiece including low resistance interconnect low-resistance interconnect | Shao-Kuan Lee, Cheng-Chin Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu +2 more | 2025-04-15 |
| 12272597 | Semiconductor interconnection structures and methods of forming the same | Cheng-Chin Lee, Hsiao-Kang Chang, Cherng-Shiaw Tsai, Shao-Kuan Lee, Shau-Lin Shue | 2025-04-08 |
| 12249555 | Semiconductor device package including a thermal conductive layer and methods of forming the same | Cheng-Chin Lee, Cherng-Shiaw Tsai, Shao-Kuan Lee, Hsiao-Kang Chang, Shau-Lin Shue | 2025-03-11 |
| 12230537 | Semiconductor device structure having air gap and methods of forming the same | Ting-Ya Lo, Cheng-Chin Lee, Shao-Kuan Lee, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2025-02-18 |