Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431426 | Semiconductor interconnection structures comprising a resistor device and methods of forming the same | Kai-Fang Cheng, Cherng-Shiaw Tsai, Cheng-Chin Lee, Ming-Hsien Lin | 2025-09-30 |
| 12431386 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +4 more | 2025-09-30 |
| 12424485 | Semiconductor structure with air gap and method for manufacturing the same | Kai-Fang Cheng | 2025-09-23 |
| 12412804 | Semiconductor structure with improved heat dissipation | Cheng-Chin Lee, Shau-Lin Shue, Shao-Kuan Lee, Cherng-Shiaw Tsai, Kai-Fang Cheng +6 more | 2025-09-09 |
| 12387928 | Method for manufacturing semiconductor structure with material in monocrystalline phase | Kai-Fang Cheng | 2025-08-12 |
| 12334431 | Semiconductor interconnection structures and methods of forming the same | Kai-Fang Cheng | 2025-06-17 |
| 12272597 | Semiconductor interconnection structures and methods of forming the same | Cheng-Chin Lee, Hsin-Yen Huang, Cherng-Shiaw Tsai, Shao-Kuan Lee, Shau-Lin Shue | 2025-04-08 |
| 12249555 | Semiconductor device package including a thermal conductive layer and methods of forming the same | Cheng-Chin Lee, Cherng-Shiaw Tsai, Shao-Kuan Lee, Hsin-Yen Huang, Shau-Lin Shue | 2025-03-11 |