Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
HT

Hsi-Wen Tien

TSMC: 14 patents #136 of 3,957Top 4%
📍 Xinfeng, TW: #2 of 4 inventorsTop 50%
Overall (2025): #3,147 of 469,880Top 1%
14
Patents 2025

Issued Patents 2025

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
12424488 Dual etch-stop layer structure Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee 2025-09-23
12412831 Semiconductor device structure and methods of forming the same Wei-Hao Liao, Chih Wei Lu, Yung-Hsu Wu, Cherng-Shiaw Tsai, Chia-Wei Su 2025-09-09
12406924 Interconnection structure and methods of forming the same Wei-Hao Liao, Yu-Teng Dai, Chih Wei Lu, Hsin-Chieh Yao, Chung-Ju Lee 2025-09-02
12368046 Method and structure of cut end with self-aligned double patterning Wei-Hao Liao, Pin-Ren Dai, Chih Wei Lu, Chung-Ju Lee 2025-07-22
12362231 Self-assembled dielectric on metal rie lines to increase reliability Wei-Hao Liao, Chih Wei Lu, Yu-Teng Dai, Hsin-Chieh Yao, Chung-Ju Lee 2025-07-15
12354881 Methods of etching metals in semiconductor devices Wei-Hao Liao, Chih Wei Lu, Pin-Ren Dai, Chung-Ju Lee 2025-07-08
12322723 Self-aligned interconnect structure Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Yu-Teng Dai, Wei-Hao Liao 2025-06-03
12315817 Dielectric on wire structure to increase processing window for overlying via Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Yu-Teng Dai, Wei-Hao Liao 2025-05-27
12310255 Structure and method for an MRAM device with a multi-layer top electrode Wei-Hao Liao, Chih Wei Lu, Pin-Ren Dai, Chung-Ju Lee 2025-05-20
12300541 Structure and formation method of semiconductor device with carbon-containing conductive structure Wei-Hao Liao, Yu-Teng Dai, Chih Wei Lu, Hsin-Chieh Yao, Hwei-Jay CHU 2025-05-13
12302761 Magnetic tunnel junction devices Wei-Hao Liao, Pin-Ren Dai, Chih Wei Lu, Chung-Ju Lee 2025-05-13
12300611 Interconnect conductive structure comprising two conductive materials Yu-Teng Dai, Wei-Hao Liao, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee 2025-05-13
12266565 Integrated chip with an etch-stop layer forming a cavity Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Shau-Lin Shue, Yu-Teng Dai +1 more 2025-04-01
12243775 Double patterning approach by direct metal etch Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee 2025-03-04