Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424488 | Dual etch-stop layer structure | Hsi-Wen Tien, Wei-Hao Liao, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee | 2025-09-23 |
| 12406924 | Interconnection structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Hsin-Chieh Yao, Chung-Ju Lee | 2025-09-02 |
| 12362231 | Self-assembled dielectric on metal rie lines to increase reliability | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Hsin-Chieh Yao, Chung-Ju Lee | 2025-07-15 |
| 12322723 | Self-aligned interconnect structure | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao | 2025-06-03 |
| 12315817 | Dielectric on wire structure to increase processing window for overlying via | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Wei-Hao Liao | 2025-05-27 |
| 12300541 | Structure and formation method of semiconductor device with carbon-containing conductive structure | Wei-Hao Liao, Hsi-Wen Tien, Chih Wei Lu, Hsin-Chieh Yao, Hwei-Jay CHU | 2025-05-13 |
| 12300611 | Interconnect conductive structure comprising two conductive materials | Hsi-Wen Tien, Wei-Hao Liao, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee | 2025-05-13 |
| 12266565 | Integrated chip with an etch-stop layer forming a cavity | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Shau-Lin Shue +1 more | 2025-04-01 |
| 12243775 | Double patterning approach by direct metal etch | Hsi-Wen Tien, Wei-Hao Liao, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee | 2025-03-04 |