Issued Patents 2025
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424488 | Dual etch-stop layer structure | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chung-Ju Lee | 2025-09-23 |
| 12412831 | Semiconductor device structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Yung-Hsu Wu, Cherng-Shiaw Tsai, Chia-Wei Su | 2025-09-09 |
| 12406924 | Interconnection structure and methods of forming the same | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Hsin-Chieh Yao, Chung-Ju Lee | 2025-09-02 |
| 12368046 | Method and structure of cut end with self-aligned double patterning | Hsi-Wen Tien, Wei-Hao Liao, Pin-Ren Dai, Chung-Ju Lee | 2025-07-22 |
| 12362231 | Self-assembled dielectric on metal rie lines to increase reliability | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Hsin-Chieh Yao, Chung-Ju Lee | 2025-07-15 |
| 12354881 | Methods of etching metals in semiconductor devices | Wei-Hao Liao, Hsi-Wen Tien, Pin-Ren Dai, Chung-Ju Lee | 2025-07-08 |
| 12322723 | Self-aligned interconnect structure | Hsin-Chieh Yao, Chung-Ju Lee, Hsi-Wen Tien, Yu-Teng Dai, Wei-Hao Liao | 2025-06-03 |
| 12315817 | Dielectric on wire structure to increase processing window for overlying via | Hsin-Chieh Yao, Chung-Ju Lee, Hsi-Wen Tien, Yu-Teng Dai, Wei-Hao Liao | 2025-05-27 |
| 12310255 | Structure and method for an MRAM device with a multi-layer top electrode | Wei-Hao Liao, Hsi-Wen Tien, Pin-Ren Dai, Chung-Ju Lee | 2025-05-20 |
| 12308238 | Method and structure for semiconductor device having gate spacer protection layer | Chung-Ju Lee, Hai-Ching Chen, Chien-Hua Huang, Tien-I Bao | 2025-05-20 |
| 12300541 | Structure and formation method of semiconductor device with carbon-containing conductive structure | Wei-Hao Liao, Hsi-Wen Tien, Yu-Teng Dai, Hsin-Chieh Yao, Hwei-Jay CHU | 2025-05-13 |
| 12302761 | Magnetic tunnel junction devices | Hsi-Wen Tien, Wei-Hao Liao, Pin-Ren Dai, Chung-Ju Lee | 2025-05-13 |
| 12300611 | Interconnect conductive structure comprising two conductive materials | Yu-Teng Dai, Hsi-Wen Tien, Wei-Hao Liao, Hsin-Chieh Yao, Chung-Ju Lee | 2025-05-13 |
| 12266565 | Integrated chip with an etch-stop layer forming a cavity | Hsi-Wen Tien, Chung-Ju Lee, Hsin-Chieh Yao, Shau-Lin Shue, Yu-Teng Dai +1 more | 2025-04-01 |
| 12261121 | Structure and method for a low-k dielectric with pillar-type air-gaps | Chung-Ju Lee, Tien-I Bao | 2025-03-25 |
| 12243775 | Double patterning approach by direct metal etch | Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chung-Ju Lee | 2025-03-04 |
| 12211845 | Semiconductor device and a method for fabricating the same | Hsiang-Ku Shen, Hui-Chi Chen, Jeng-Ya David Yeh | 2025-01-28 |