Issued Patents 2025
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424488 | Dual etch-stop layer structure | Hsi-Wen Tien, Yu-Teng Dai, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee | 2025-09-23 |
| 12412831 | Semiconductor device structure and methods of forming the same | Hsi-Wen Tien, Chih Wei Lu, Yung-Hsu Wu, Cherng-Shiaw Tsai, Chia-Wei Su | 2025-09-09 |
| 12406924 | Interconnection structure and methods of forming the same | Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Hsin-Chieh Yao, Chung-Ju Lee | 2025-09-02 |
| 12368046 | Method and structure of cut end with self-aligned double patterning | Hsi-Wen Tien, Pin-Ren Dai, Chih Wei Lu, Chung-Ju Lee | 2025-07-22 |
| 12362231 | Self-assembled dielectric on metal rie lines to increase reliability | Hsi-Wen Tien, Chih Wei Lu, Yu-Teng Dai, Hsin-Chieh Yao, Chung-Ju Lee | 2025-07-15 |
| 12354881 | Methods of etching metals in semiconductor devices | Hsi-Wen Tien, Chih Wei Lu, Pin-Ren Dai, Chung-Ju Lee | 2025-07-08 |
| 12322723 | Self-aligned interconnect structure | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai | 2025-06-03 |
| 12315817 | Dielectric on wire structure to increase processing window for overlying via | Hsin-Chieh Yao, Chung-Ju Lee, Chih Wei Lu, Hsi-Wen Tien, Yu-Teng Dai | 2025-05-27 |
| 12310255 | Structure and method for an MRAM device with a multi-layer top electrode | Hsi-Wen Tien, Chih Wei Lu, Pin-Ren Dai, Chung-Ju Lee | 2025-05-20 |
| 12300541 | Structure and formation method of semiconductor device with carbon-containing conductive structure | Hsi-Wen Tien, Yu-Teng Dai, Chih Wei Lu, Hsin-Chieh Yao, Hwei-Jay CHU | 2025-05-13 |
| 12302761 | Magnetic tunnel junction devices | Hsi-Wen Tien, Pin-Ren Dai, Chih Wei Lu, Chung-Ju Lee | 2025-05-13 |
| 12300611 | Interconnect conductive structure comprising two conductive materials | Yu-Teng Dai, Hsi-Wen Tien, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee | 2025-05-13 |
| 12266565 | Integrated chip with an etch-stop layer forming a cavity | Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Shau-Lin Shue +1 more | 2025-04-01 |
| 12243775 | Double patterning approach by direct metal etch | Hsi-Wen Tien, Yu-Teng Dai, Hsin-Chieh Yao, Chih Wei Lu, Chung-Ju Lee | 2025-03-04 |