Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA | 2025-09-09 |
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2025-08-12 |
| 12334467 | Copper bonding wire | Tetsuya OYAMADA, Daizo Oda, Kota Shimomura, Tadashi Yamaguchi | 2025-06-17 |
| 12325901 | AI wiring material | Yuto KURIHARA, Ryo OISHI, Motoki ETO, Daizo Oda, Tetsuya OYAMADA +1 more | 2025-06-10 |
| 12300658 | Copper alloy bonding wire for semiconductor devices | Daizo Oda, Takashi Yamada, Motoki ETO, Teruo Haibara | 2025-05-13 |
| 12299305 | Information processing device and non-transitory computer-readable storage medium | Shota Yamashita, Tomonori Furuta | 2025-05-13 |