Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12389656 | Semiconductor device and method of manufacturing the same | — | 2025-08-12 |
| 12334467 | Copper bonding wire | Tomohiro Uno, Tetsuya OYAMADA, Daizo Oda, Kota Shimomura | 2025-06-17 |