Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tomohiro Uno | 2025-09-09 |
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2025-08-12 |
| 12334467 | Copper bonding wire | Tomohiro Uno, Daizo Oda, Kota Shimomura, Tadashi Yamaguchi | 2025-06-17 |
| 12325901 | AI wiring material | Yuto KURIHARA, Ryo OISHI, Motoki ETO, Daizo Oda, Yuya SUTO +1 more | 2025-06-10 |