Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2025-09-09 |
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2025-08-12 |
| 12300658 | Copper alloy bonding wire for semiconductor devices | Daizo Oda, Takashi Yamada, Motoki ETO, Tomohiro Uno | 2025-05-13 |