Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya OYAMADA, Tomohiro Uno | 2025-09-09 |
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Motoki ETO, Tetsuya OYAMADA +2 more | 2025-08-12 |
| 12334467 | Copper bonding wire | Tomohiro Uno, Tetsuya OYAMADA, Kota Shimomura, Tadashi Yamaguchi | 2025-06-17 |
| 12325901 | AI wiring material | Yuto KURIHARA, Ryo OISHI, Motoki ETO, Tetsuya OYAMADA, Yuya SUTO +1 more | 2025-06-10 |
| 12300658 | Copper alloy bonding wire for semiconductor devices | Takashi Yamada, Motoki ETO, Teruo Haibara, Tomohiro Uno | 2025-05-13 |
| 12290883 | Bonding wire | Motoki ETO, Ryo OISHI | 2025-05-06 |