Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388044 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Tetsuya OYAMADA +2 more | 2025-08-12 |
| 12325901 | AI wiring material | Yuto KURIHARA, Ryo OISHI, Daizo Oda, Tetsuya OYAMADA, Yuya SUTO +1 more | 2025-06-10 |
| 12300658 | Copper alloy bonding wire for semiconductor devices | Daizo Oda, Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2025-05-13 |
| 12290883 | Bonding wire | Daizo Oda, Ryo OISHI | 2025-05-06 |