Issued Patents 2025
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412864 | Bonding wire for semiconductor devices | Daizo Oda, Takumi Ohkabe, Teruo Haibara, Tetsuya OYAMADA, Tomohiro Uno | 2025-09-09 |
| 12407307 | Power amplification circuit, radio-frequency circuit, and communication device | Kenji Tahara, Kenichi Shimamoto | 2025-09-02 |
| 12407302 | Power amplifier circuit | Toshikazu Terashima, Yuri HONDA | 2025-09-02 |
| 12395195 | Radio-frequency module and communication device | Takanori UEJIMA, Dai NAKAGAWA, Yukiya YAMAGUCHI, Yuji TAKEMATSU, Motoji TSUDA +3 more | 2025-08-19 |
| 12388044 | Al bonding wire | Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2025-08-12 |
| 12362831 | Optical main signal processing node apparatus and control method of optical main signal processing node apparatus | Kota Asaka, Keita NISHIMOTO, Yukio TOYOSHIMA, Junichi KANI | 2025-07-15 |
| 12316289 | Power amplifying circuit | — | 2025-05-27 |
| 12300658 | Copper alloy bonding wire for semiconductor devices | Daizo Oda, Motoki ETO, Teruo Haibara, Tomohiro Uno | 2025-05-13 |
| 12248181 | Optical module | Yuriko Kawamura, Yusuke Nasu, Yuichiro Ikuma | 2025-03-11 |
| 12233428 | Dispenser | — | 2025-02-25 |
| 12222567 | Optical circuit module | Yuichiro Ikuma, Yusuke Nasu | 2025-02-11 |