Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2025-07-15 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Nicholas S. Haehn, Edvin Cetegen, Jacob VEHONSKY, Steve Cho +4 more | 2025-06-17 |
| 12272614 | Integrated circuit packages with solder thermal interface materials with embedded particles | Amitesh Saha, Marco Aurelio Cartas, Ken Hackenberg, Peng Li | 2025-04-08 |
| 12238892 | Immersion cooling for integrated circuit devices | Raanan Sover, James D. Williams, Bradley H. Smith, Nir Peled, Paul C. GEORGE +9 more | 2025-02-25 |
| 12205915 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Jimin Yao, Chandra Mohan Jha | 2025-01-21 |