Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272614 | Integrated circuit packages with solder thermal interface materials with embedded particles | Amitesh Saha, Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Peng Li | 2025-04-08 |