Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272614 | Integrated circuit packages with solder thermal interface materials with embedded particles | Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Ken Hackenberg, Peng Li | 2025-04-08 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272614 | Integrated circuit packages with solder thermal interface materials with embedded particles | Sergio Antonio Chan Arguedas, Marco Aurelio Cartas, Ken Hackenberg, Peng Li | 2025-04-08 |