Issued Patents 2025
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381119 | Seal for microelectronic assembly | Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2025-08-05 |
| 12374641 | Sealed bonded structures and methods for forming the same | Arkalgud R. Sitaram, Laura Wills Mirkarimi | 2025-07-29 |
| 12374656 | Multi-chip modules formed using wafer-level processing of a reconstituted wafer | Liang Wang | 2025-07-29 |
| 12368087 | Embedded cooling systems for advanced device packaging and methods of manufacturing the same | Belgacem Haba, Ron Zhang, Thomas Workman, Gaius Gillman Fountain, Jr. | 2025-07-22 |
| 12324268 | Image sensor device | — | 2025-06-03 |
| 12322667 | Seal for microelectronic assembly | Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2025-06-03 |
| 12322650 | Diffusion barrier for interconnects | Cyprian Emeka Uzoh | 2025-06-03 |
| 12300634 | Protective semiconductor elements for bonded structures | Belgacem Haba, Laura Wills Mirkarimi, Christopher Aubuchon | 2025-05-13 |
| 12289428 | System and method to prioritize and resume disconnected customer interactions | Bhupendra Pandey, Dhanendra Singh, Salil Dhawan | 2025-04-29 |
| 12288771 | Apparatus for non-volatile random access memory stacks | Javier A. Delacruz, Belgacem Haba, Pearl Po-Yee Cheng | 2025-04-29 |
| 12283572 | Symbiotic network on layers | Javier A. Delacruz, Belgacem Haba | 2025-04-22 |
| 12270970 | Direct-bonded lamination for improved image clarity in optical devices | Belgacem Haba, Ilyas Mohammed | 2025-04-08 |
| 12272677 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2025-04-08 |
| 12266640 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba | 2025-04-01 |
| 12218107 | Electrical redundancy for bonded structures | Belgacem Haba | 2025-02-04 |
| 12205926 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba +1 more | 2025-01-21 |
| 12198981 | Diffusion barrier collar for interconnects | Cyprian Emeka Uzoh | 2025-01-14 |
| 12199082 | Method of direct-bonded optoelectronic devices | Min Tao, Liang Wang, Cyprian Emeka Uzoh | 2025-01-14 |
| RE50272 | Remote optical engine for virtual reality or augmented reality headsets | Belgacem Haba, Ilyas Mohammed | 2025-01-14 |
| 12191233 | Embedded cooling systems and methods of manufacturing embedded cooling systems | Belgacem Haba, Thomas Workman, Cyprian Emeka Uzoh, Guilian Gao | 2025-01-07 |
| 12191235 | Integrated cooling assemblies including signal redistribution and methods of manufacturing the same | Belgacem Haba | 2025-01-07 |