Issued Patents 2025
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417950 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Guilian Gao, Laura Wills Mirkarimi | 2025-09-16 |
| 12412808 | Cold plate and manifold integration for high reliability | Ron Zhang, Laura Wills Mirkarimi | 2025-09-09 |
| 12406959 | Post CMP processing for hybrid bonding | Guilian Gao, Chandrasekhar Mandalapu | 2025-09-02 |
| 12406975 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Guilian Gao | 2025-09-02 |
| 12381128 | Structures with through-substrate vias and methods for forming the same | Guilian Gao | 2025-08-05 |
| 12381173 | Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface | Chandrasekhar Mandalapu, Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2025-08-05 |
| 12368087 | Embedded cooling systems for advanced device packaging and methods of manufacturing the same | Belgacem Haba, Rajesh Katkar, Ron Zhang, Thomas Workman | 2025-07-22 |
| 12341125 | Dimension compensation control for directly bonded structures | Guilian Gao, Laura Wills Mirkarimi, Cyprian Emeka Uzoh | 2025-06-24 |
| 12341083 | Electronic device cooling structures bonded to semiconductor elements | Belgacem Haba, Thomas Workman, Kyong-Mo Bang, Ron Zhang | 2025-06-24 |
| 12336141 | Cold plate cavity designs for improved thermal performance | Ron Zhang, Belgacem Haba | 2025-06-17 |
| 12322677 | Fluid channel geometry optimizations to improve cooling efficiency | Ron Zhang, Belgacem Haba, Kyong-Mo Bang, Laura Wills Mirkarimi, Suhail Jaan Sadiq | 2025-06-03 |
| 12300662 | DBI to SI bonding for simplified handle wafer | Chandrasekhar Mandalapu, Guilian Gao | 2025-05-13 |
| 12283490 | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same | Belgacem Haba, George Carlton Hudson, Pawel Mrozek, Suhail Jaan Sadiq, Laura Wills Mirkarimi | 2025-04-22 |
| 12272677 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Laura Wills Mirkarimi +3 more | 2025-04-08 |
| 12266545 | Structures and methods for integrated cold plate in XPUs and memory | Laura Wills Mirkarimi, Belgacem Haba | 2025-04-01 |
| 12205926 | TSV as pad | Guilian Gao, Bongsub Lee, Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more | 2025-01-21 |
| 12199069 | Heterogeneous annealing method and device | Paul M. Enquist | 2025-01-14 |
| 12199011 | Embedded liquid cooling | Belgacem Haba | 2025-01-14 |
| 12191234 | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same | Belgacem Haba, Kyong-Mo Bang | 2025-01-07 |