Issued Patents 2025
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417950 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2025-09-16 |
| 12406975 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2025-09-02 |
| 12406959 | Post CMP processing for hybrid bonding | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu | 2025-09-02 |
| 12381119 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Ilyas Mohammed | 2025-08-05 |
| 12381128 | Structures with through-substrate vias and methods for forming the same | Gaius Gillman Fountain, Jr. | 2025-08-05 |
| 12374556 | Processing stacked substrates | Cyprian Emeka Uzoh | 2025-07-29 |
| 12341125 | Dimension compensation control for directly bonded structures | Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2025-06-24 |
| 12322667 | Seal for microelectronic assembly | Rajesh Katkar, Liang Wang, Cyprian Emeka Uzoh, Shaowu Huang, Ilyas Mohammed | 2025-06-03 |
| 12300662 | DBI to SI bonding for simplified handle wafer | Chandrasekhar Mandalapu, Gaius Gillman Fountain, Jr. | 2025-05-13 |
| 12272677 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2025-04-08 |
| 12271032 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Javier A. Delacruz, Liang Wang | 2025-04-08 |
| 12266640 | Molded direct bonded and interconnected stack | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2025-04-01 |
| 12261099 | Embedded cooling systems with coolant channel for device packaging | Belgacem Haba, Laura Wills Mirkarimi | 2025-03-25 |
| 12243851 | Offset pads over TSV | Bongsub Lee | 2025-03-04 |
| 12205926 | TSV as pad | Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Belgacem Haba, Laura Wills Mirkarimi +1 more | 2025-01-21 |
| 12191233 | Embedded cooling systems and methods of manufacturing embedded cooling systems | Belgacem Haba, Thomas Workman, Cyprian Emeka Uzoh, Rajesh Katkar | 2025-01-07 |