Issued Patents 2025
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431449 | Circuitry for electrical redundancy in bonded structures | Belgacem Haba, Jung Ko | 2025-09-30 |
| 12401010 | 3D processor having stacked integrated circuit die | Steven Teig, Ilyas Mohammed, Kenneth Duong | 2025-08-26 |
| 12362182 | Direct-bonded native interconnects and active base die | Steven Teig, Shaowu Huang, William C. Plants, David Edward Fisch | 2025-07-15 |
| 12308332 | Circuitry for electrical redundancy in bonded structures | Belgacem Haba, Jung Ko | 2025-05-20 |
| 12293993 | 3D chip sharing data bus | Steven Teig, Ilyas Mohammed | 2025-05-06 |
| 12293108 | 3D memory circuit | David Edward Fisch | 2025-05-06 |
| 12288771 | Apparatus for non-volatile random access memory stacks | Belgacem Haba, Rajesh Katkar, Pearl Po-Yee Cheng | 2025-04-29 |
| 12283572 | Symbiotic network on layers | Belgacem Haba, Rajesh Katkar | 2025-04-22 |
| 12278215 | Integrated voltage regulator and passive components | Don Draper, Belgacem Haba, Ilyas Mohammed | 2025-04-15 |
| 12271032 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Liang Wang, Guilian Gao | 2025-04-08 |
| 12272730 | Transistor level interconnection methodologies utilizing 3D interconnects | David Edward Fisch | 2025-04-08 |
| 12255176 | Scalable architecture for reduced cycles across SOC | Richard E. Perego | 2025-03-18 |
| 12218059 | Stacked IC structure with orthogonal interconnect layers | Ilyas Mohammed, Steven Teig | 2025-02-04 |