Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362182 | Direct-bonded native interconnects and active base die | Javier A. Delacruz, Steven Teig, Shaowu Huang, William C. Plants | 2025-07-15 |
| 12293108 | 3D memory circuit | Javier A. Delacruz | 2025-05-06 |
| 12272730 | Transistor level interconnection methodologies utilizing 3D interconnects | Javier A. Delacruz | 2025-04-08 |