Issued Patents 2025
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431449 | Circuitry for electrical redundancy in bonded structures | Javier A. Delacruz, Jung Ko | 2025-09-30 |
| 12401011 | Stacked devices and methods of fabrication | Paul M. Enquist | 2025-08-26 |
| 12368087 | Embedded cooling systems for advanced device packaging and methods of manufacturing the same | Rajesh Katkar, Ron Zhang, Thomas Workman, Gaius Gillman Fountain, Jr. | 2025-07-22 |
| 12347820 | Stacked devices and methods of fabrication | Paul M. Enquist | 2025-07-01 |
| 12341025 | Microelectronic assemblies | — | 2025-06-24 |
| 12341083 | Electronic device cooling structures bonded to semiconductor elements | Gaius Gillman Fountain, Jr., Thomas Workman, Kyong-Mo Bang, Ron Zhang | 2025-06-24 |
| 12336141 | Cold plate cavity designs for improved thermal performance | Ron Zhang, Gaius Gillman Fountain, Jr. | 2025-06-17 |
| 12322718 | Bonded structure with interconnect structure | — | 2025-06-03 |
| 12322677 | Fluid channel geometry optimizations to improve cooling efficiency | Ron Zhang, Gaius Gillman Fountain, Jr., Kyong-Mo Bang, Laura Wills Mirkarimi, Suhail Jaan Sadiq | 2025-06-03 |
| 12308332 | Circuitry for electrical redundancy in bonded structures | Javier A. Delacruz, Jung Ko | 2025-05-20 |
| 12300634 | Protective semiconductor elements for bonded structures | Laura Wills Mirkarimi, Christopher Aubuchon, Rajesh Katkar | 2025-05-13 |
| 12288771 | Apparatus for non-volatile random access memory stacks | Javier A. Delacruz, Rajesh Katkar, Pearl Po-Yee Cheng | 2025-04-29 |
| 12283490 | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same | Gaius Gillman Fountain, Jr., George Carlton Hudson, Pawel Mrozek, Suhail Jaan Sadiq, Laura Wills Mirkarimi | 2025-04-22 |
| 12283572 | Symbiotic network on layers | Javier A. Delacruz, Rajesh Katkar | 2025-04-22 |
| 12278215 | Integrated voltage regulator and passive components | Javier A. Delacruz, Don Draper, Ilyas Mohammed | 2025-04-15 |
| 12272677 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Gaius Gillman Fountain, Jr. +3 more | 2025-04-08 |
| 12270970 | Direct-bonded lamination for improved image clarity in optical devices | Rajesh Katkar, Ilyas Mohammed | 2025-04-08 |
| 12272673 | Capacitive coupling in a direct-bonded interface for microelectronic devices | Arkalgud R. Sitaram | 2025-04-08 |
| 12266640 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar | 2025-04-01 |
| 12266545 | Structures and methods for integrated cold plate in XPUs and memory | Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2025-04-01 |
| 12261099 | Embedded cooling systems with coolant channel for device packaging | Guilian Gao, Laura Wills Mirkarimi | 2025-03-25 |
| 12237306 | Correction die for wafer/die stack | — | 2025-02-25 |
| 12218107 | Electrical redundancy for bonded structures | Rajesh Katkar | 2025-02-04 |
| 12205926 | TSV as pad | Guilian Gao, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi +1 more | 2025-01-21 |
| 12199011 | Embedded liquid cooling | Gaius Gillman Fountain, Jr. | 2025-01-14 |