Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374641 | Sealed bonded structures and methods for forming the same | Rajesh Katkar, Laura Wills Mirkarimi | 2025-07-29 |
| 12272673 | Capacitive coupling in a direct-bonded interface for microelectronic devices | Belgacem Haba | 2025-04-08 |
| 12266650 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2025-04-01 |