Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381173 | Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface | Gaius Gillman Fountain, Jr., Chandrasekhar Mandalapu, Cyprian Emeka Uzoh | 2025-08-05 |
| 12341018 | Method for preparing a surface for direct-bonding | — | 2025-06-24 |
| 12266640 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar | 2025-04-01 |