Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406959 | Post CMP processing for hybrid bonding | Gaius Gillman Fountain, Jr., Guilian Gao | 2025-09-02 |
| 12381173 | Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface | Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2025-08-05 |
| 12300662 | DBI to SI bonding for simplified handle wafer | Gaius Gillman Fountain, Jr., Guilian Gao | 2025-05-13 |