Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2025-07-15 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY, Steve Cho +4 more | 2025-06-17 |
| 12266589 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Zhimin Wan | 2025-04-01 |
| 12261150 | Mold shelf package design and process flow for advanced package architectures | Wei Li, Edvin Cetegen, Nicholas S. Haehn, Ram Viswanath, Mitul Modi | 2025-03-25 |