| 12424522 |
Leadless semiconductor packages, leadframes therefor, and methods of making |
Darrell D. Truhitte, Soon Wei WANG |
2025-09-23 |
| 12402264 |
Stacked power terminals in a power electronics module |
Vemmond Jeng Hung NG, Yushuang YAO |
2025-08-26 |
| 12394692 |
Power circuit module |
Atapol Prajuckamol, Olaf Zschieschang |
2025-08-19 |
| 12374555 |
Die sidewall coatings and related methods |
Francis J. Carney, Yusheng LIN, Michael J. Seddon, Soon Wei WANG, Eiji KUROSE |
2025-07-29 |
| 12374554 |
Semiconductor packages with die including cavities and related methods |
Michael J. Seddon, Francis J. Carney, Soon Wei WANG, Eiji KUROSE |
2025-07-29 |
| 12362266 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2025-07-15 |
| 12355009 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2025-07-08 |
| 12347755 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2025-07-01 |
| 12347813 |
Semiconductor package and related methods |
Erik Nino Tolentino, Vemmond Jeng Hung NG, Shutesh Krishnan |
2025-07-01 |
| 12347812 |
Low stress asymmetric dual side module |
Atapol Prajuckamol, Stephen St. Germain, Yusheng LIN |
2025-07-01 |
| 12308297 |
Semiconductor package system and related methods |
Yushuang YAO, Atapol Prajuckamol |
2025-05-20 |
| 12300558 |
Substrates and related methods |
Atapol Prajuckamol, Yushuang YAO, Vemmond Jeng Hung NG |
2025-05-13 |
| 12283562 |
Clip design and method of controlling clip position |
Atapol Prajuckamol, Vemmond Jeng Hung NG |
2025-04-22 |
| 12243810 |
Semiconductor package with wettable flank and related methods |
Hui Min LER, Soon Wei WANG |
2025-03-04 |
| 12211775 |
Multiple substrate package systems and related methods |
Atapol Prajuckamol, Yusheng LIN |
2025-01-28 |