Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131914 | Selective etching with fluorine, oxygen and noble gas containing plasmas | Du Zhang, Hojin Kim, Shigeru Tahara, Kaoru Maekawa, Mingmei Wang +4 more | 2024-10-29 |
| 12112959 | Processing systems and platforms for roughness reduction of materials using illuminated etch solutions | Omid Zandi | 2024-10-08 |
| 11915941 | Dynamically adjusted purge timing in wet atomic layer etching | Tetsuya Sakazaki, Paul Abel | 2024-02-27 |
| 11866831 | Methods for wet atomic layer etching of copper | Christopher NETZBAND, Paul Abel, Arkalgud R. Sitaram | 2024-01-09 |