Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113056 | Stacked dies and methods for forming bonded structures | Cyprian Emeka Uzoh, Paul M. Enquist | 2024-10-08 |
| 12100684 | Bonded structures | Liang Wang, Rajesh Katkar, Javier A. Delacruz | 2024-09-24 |
| 11866831 | Methods for wet atomic layer etching of copper | Christopher NETZBAND, Paul Abel, Jacques Faguet | 2024-01-09 |